Category Archives: smartphones

iFixit teardown shows Apple’s thinnest iPhone is easily repairable

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**iFixit Teardown Shows Apple’s Thinnest iPhone Is Surprisingly Repairable**
*By Akash Pandey | Sep 21, 2025*

Apple’s latest release, the iPhone Air, is its thinnest smartphone yet, measuring just 5.6mm thick. Renowned repair expert iFixit recently performed a detailed teardown of the device, revealing a design that balances extreme thinness with an unexpectedly high level of repairability.

### Innovative Design Meets Repairability

The iPhone Air represents the biggest redesign in the iPhone lineup in years. This teardown highlights Apple’s innovative engineering to pack all essential components into such a slim form factor without sacrificing durability or serviceability.

### Camera “Plateau” Integrates Logic Board

To accommodate internal parts within the ultra-thin chassis, Apple introduced a clever “camera plateau” design. This design integrates part of the logic board into the camera bump, freeing up space for a large metal-encased battery.

This strategic placement not only optimizes space but also helps protect the logic board from bending stress, enhancing the device’s durability against accidental flexing.

### Durable Titanium Frame with Plastic Gaps

The iPhone Air features a titanium frame that resists flexing exceptionally well. However, when stripped of its internal components during teardown, the chassis is more prone to bending due to plastic gaps incorporated to reduce cellular interference.

Whether these structural weak points will impact the device’s long-term durability remains to be seen.

### Battery Compatibility Confirmed

iFixit’s teardown also confirms earlier speculation regarding Apple’s MagSafe Battery Pack. The 12.26W-hour battery inside the pack is the same as the one used in the iPhone Air and can be removed and installed in the phone itself, adding versatility for users.

### Easier Repair Than Expected

Despite its ultra-thin profile, the iPhone Air is surprisingly easy to repair. The internal layout is simplified, with components not overly layered or difficult to access. Both the display and back glass are clipped in place without adhesive, making removal straightforward.

The battery employs a low-voltage electrical current adhesive loosening technique, first introduced with last year’s iPhone 16, enabling safer and easier battery replacement.

### Repairability Score and Improvements

iFixit gave the iPhone Air a provisional repairability score of 7 out of 10. Positive aspects include easier battery access, relatively simple screen replacement, and Apple’s ongoing commitment to repair-friendly practices.

Additionally, Apple has improved repairability by offering spare parts and manuals, and reducing software locks or restrictions related to parts pairing.

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Overall, the iPhone Air proves that ultra-slim design can coexist with thoughtful engineering to support user and technician repairs, marking a noteworthy shift in Apple’s approach to device serviceability.
https://www.newsbytesapp.com/news/science/ifixit-s-iphone-air-teardown-reveals-sleek-design-surprisingly-easy-reparability/story

MediaTek to launch its Qualcomm Snapdragon 8 Elite Gen 5 rival chip on Sept 22

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MediaTek has announced that its next flagship Dimensity mobile SoC will officially be unveiled on September 22, 2025. The Taiwanese tech giant has yet to reveal the name or any additional details about the new chip. Interestingly, this launch is scheduled just one day before rival Qualcomm announces its own top-tier Snapdragon 8 Elite Gen 5 processor.

On Chinese social media platform Weibo, MediaTek confirmed the September 22 launch date for its upcoming flagship processor. Qualcomm is set to reveal its next flagship 8-series chip, the Snapdragon 8 Elite Gen 5, a day later on September 23.

While MediaTek has not provided further specifics, rumors suggest the new processor will be called the Dimensity 9500. This chip is expected to be the successor to the Dimensity 9400, which was launched last year. The Dimensity 9400 currently powers flagship smartphones such as the Oppo Find X8 Pro. However, it has still lagged slightly behind the Snapdragon 8 Elite in performance benchmarks.

According to Geekbench scores, the Snapdragon 8 Elite-powered Samsung S25 Ultra achieved a single-core score of 2,860, while the Oppo Find X8 Pro scored 2,648. In comparison, a Dimensity 9500-powered Oppo device, believed to be the Oppo Find X9 Pro, recorded a significantly higher single-core score of 3,394.

### MediaTek Confirms Successful Test of 2nm Chip Process

The Dimensity 9400 is manufactured using Taiwanese chipmaker TSMC’s 3nm process, and the Dimensity 9500 is also expected to utilize the same technology. Qualcomm’s Snapdragon 8 Elite Gen 5 will similarly be based on the 3nm process.

However, MediaTek has confirmed that it has successfully adopted TSMC’s 2nm process technology, which could debut in a future chip. The 2nm process features a nanosheet transistor structure, promising enhanced performance and improved power efficiency. Additionally, a higher manufacturing yield is anticipated with this advanced technology.

Despite this progress, users will need to wait longer before seeing a MediaTek chip built on the 2nm process enter the market.

In parallel, Samsung is rumored to be developing its own 2nm process for the upcoming Exynos 2600 chip. This new SoC is expected to power the Samsung S26 Pro and S26 Edge smartphones slated for release next year.

Stay tuned for more updates as both MediaTek and Qualcomm gear up for their flagship launches later this month.
https://www.indiatoday.in/technology/news/story/mediatek-to-launch-its-qualcomm-snapdragon-8-elite-gen-5-rival-chip-on-sept-22-details-here-2788827-2025-09-18?utm_source=rss